Effect of capillary tip shape on deformation and bondability in Au wire bonding
Effect of capillary tip shape on deformation and bondability in Au wire bonding Hiroyuki Saiki1, Yasuo Marumo1a, Hiroshi Nishitake2, Tetsuhiro Uemura1, Takahiro Yotsumoto2 1Department of Mechanical System Engineering, Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555 Japan. 2a Sony Semiconductor Kyushu Co. Ltd., Japan. DOI: https://doi.org/10.7494/cmms.2007.1.0130 Abstract: Au wire bonding is … Read more